according to Linus, you can reflow Lead free solder at 196c... The real reason you can get GPU's to work again by WARMING them up is due to a design fault with flip chip packages. Basically the issue is from a connection problem between the Processor die and the PCB substrate and has nothing to do with the BGA. Also note that the Die is under-filled, under fill doesn't really soften at the same temp as lead free solder (much higher, if at all). This is why wrapping a towel around an xbox 360 worked.. think about it, let's rough it out and say lead free solder melts at 220c, go take your xbox and pop in the oven (case and all) for 15 minutes at 220c.. post pics Oh he also claims to know the science behind the soldering techniques used.... fml
I was going back looking for another thread, but I hatttteeee it when a popular person says things I conclusively know are untrue. I usually try and do my research and say true (or subjective, which is different) things in my videos, but I'm not perfect. Also I never make videos on a flawed premise.
People saying you can reflow processor by overheating it are retards. I'm so over trying to explain this repeatly for the last 10 years or so
I watched one of his videos regarding removing the thermal compound under the shielding for the CPU (and took a razor and such to it) Generally speaking if he has to go to that length to prove a point that wasn't even as controlled as possible then who should give a relative shit? I may not be smart enough to do these things but I am smart enough to know if you need to prove a point then fucking do it as controlled as possible. That said, I happen to be an expert on pointing out issues. It's in my degree.
